Electronic Component Market News– Week 1, November

【Memory Chips】

1、SK Hynix has signed long-term supply agreements with 14 global cloud vendors, securing over 50% of its HBM capacity for 2027–2028. Samsung’s entire 2027 HBM supply is pre-sold, with mass production of HBM4 scheduled to ramp up in Q2 next year.
2、J.P. Morgan forecasts that the average HBM price will rise another 54% in 2027; the unit price of HBM4 may double to USD 4–5 per GB. Micron’s 2027 HBM capacity is largely covered by long-term contracts.
3、ChangXin Memory posted a net profit of CNY 54.4 billion in Q3. Its 6th‑generation 4F² process has passed engineering sample verification, and preparations for trial production of HBM3E are underway. Jensen Huang stated he is open to cooperation with ChangXin Memory.
4、South Korea’s semiconductor exports reached USD 56.44 billion in October, surging 259% year‑on‑year. The combined operating profit of the world’s top five memory vendors in Q3 surpassed that of the top five US tech giants for the first time.
5、Memory price hikes are passing through to end products: memory cost accounts for over 30% of the total BOM cost of flagship smartphones, and nearly 50% for high‑end models. Goke Microelectronics will raise prices of co‑packaged KGD memory starting November.

【Passive Components】

1、Murata announced a 1-trillion-Japanese-yen capital expenditure plan over five years for MLCC capacity expansion, targeting to double its MLCC sales by 2031. The capacity utilization rate of high‑end MLCC for AI servers remains at 96%, with a book‑to‑bill ratio of 1.28.
2、Samsung Electro-Mechanics has extended lead times across all MLCC product lines to 52 weeks, meaning orders will require a one‑year wait. Prices of consumer‑grade X5R MLCC will rise another 25%–30% in Q4, while high‑end X6S for AI applications will increase by 10%–20%.
3、Yageo’s overall factory capacity utilization stands at 95.2%. Orders for passive components for AI servers now make up 33% of its total order book. Fenghua Hi-Tech’s revenue from high‑end server MLCC jumped 82% year‑on‑year.
4、Sunlord Electronics’ monthly shipments of high‑current power inductors for AI servers rose 15% month‑on‑month, and its products have been designed into the BOM of five AI server OEMs. Automotive‑grade and energy‑storage passive components are also seeing robust demand growth.

【Other Updates】

1、Samsung has for the first time clarified that it will completely exit 8‑inch wafer manufacturing by the end of 2030, reallocating resources to 12‑inch advanced processes. It projects that the utilization rate for 8nm and below nodes will exceed 100% by 2027.
2、NXP has launched its third round of price adjustments this year, covering more than 1,200 automotive MCU and RF devices, effective January next year. Lead time for Infineon SiC components is 42 weeks, and onsemi has a 21‑month order visibility window for automotive power devices.