【Memory Chips】
1. CXMT is nearing the completion of LPDDR6 R&D, marking an imminent new phase for domestic high‑end mobile DRAM.
2. Samsung has commenced mass production and shipment of HBM4, while HBM4E samples have been delivered to customers, intensifying competition among South Korean manufacturers for high‑end AI memory.
3. Chip shortages will persist for Samsung in the second half of the year, with its 2nm foundry capacity fully utilized. Long‑term contracts will secure 60%‑70% of capacity to prioritize HBM and AI server memory. Demand for general‑purpose memory for PCs and mobile phones remains weak.
【MLCC Passive Components】
1. Samsung Electro‑Mechanics raised prices across its full MLCC product line by 30% effective August 1. Production capacity is shifting from consumer‑grade products to high‑capacitance AI‑oriented models, with long‑term orders secured from cloud vendors.
2. Taiyo Yuden will implement a company‑wide price increase on September 1, and delivery times cannot be guaranteed even after the price hike.
3. Major Japanese and South Korean manufacturers are cutting consumer‑grade production capacity. Medium‑to‑high‑capacitance MLCC ranging from 1‑22μF faces low inventory and severe shortages, driving substantial order inflows to domestic manufacturers such as Fenghua and Tricircles.
【Power Semiconductors】
Infineon, TI and STMicroelectronics continue to enforce price increases. Price‑rise notices for power devices from domestic players including Yangjie, Silan Microelectronics and StarSem remain in effect. Lead times for mainstream IGBTs and automotive‑grade MOSFETs generally exceed 30 weeks, and allocation‑based shipment is applied for high‑voltage devices.
1. CXMT is nearing the completion of LPDDR6 R&D, marking an imminent new phase for domestic high‑end mobile DRAM.
2. Samsung has commenced mass production and shipment of HBM4, while HBM4E samples have been delivered to customers, intensifying competition among South Korean manufacturers for high‑end AI memory.
3. Chip shortages will persist for Samsung in the second half of the year, with its 2nm foundry capacity fully utilized. Long‑term contracts will secure 60%‑70% of capacity to prioritize HBM and AI server memory. Demand for general‑purpose memory for PCs and mobile phones remains weak.
【MLCC Passive Components】
1. Samsung Electro‑Mechanics raised prices across its full MLCC product line by 30% effective August 1. Production capacity is shifting from consumer‑grade products to high‑capacitance AI‑oriented models, with long‑term orders secured from cloud vendors.
2. Taiyo Yuden will implement a company‑wide price increase on September 1, and delivery times cannot be guaranteed even after the price hike.
3. Major Japanese and South Korean manufacturers are cutting consumer‑grade production capacity. Medium‑to‑high‑capacitance MLCC ranging from 1‑22μF faces low inventory and severe shortages, driving substantial order inflows to domestic manufacturers such as Fenghua and Tricircles.
【Power Semiconductors】
Infineon, TI and STMicroelectronics continue to enforce price increases. Price‑rise notices for power devices from domestic players including Yangjie, Silan Microelectronics and StarSem remain in effect. Lead times for mainstream IGBTs and automotive‑grade MOSFETs generally exceed 30 weeks, and allocation‑based shipment is applied for high‑voltage devices.